Item

Application

Product

Alloy

Features

Viscosity

Pitch

Validity

Type

Pa.s

mm

(Cool Storage)

Sn Ag Cu Type

General Printing

S70G

M705
(Sn-3.0Ag-0.5Cu)

Comprehensive improvements in terms of storage, printing, viscosity, further, improved high heat resistant flux spattering and reliability, mounting quality, soldering results, productivity.

190

0.3    0.4-0.5 0.5-0.65

6 months

GRN360-K-V

M705
(Sn-3.0Ag-0.5Cu)

Compliant with standard SMT requirement, excellent thermal resistance.

K1-V:180  K2-V:200 K3-V:220

0.4

6 months

GWS

M705

Improved wetting on surfaces know to be difficult, such as compound electrode  connectors, and minimized voiding

200

0.4

6 months

221BM5-K3

Compliant with standard SMT application, excellent printing results, high reliability RMA type

180

0.4

3 months

Halogen Free General printing

SHF

M705

Halogen-Free type solder paste, High stability under long term processing conditions enabling use in continuous processing. Air reflow type.

200

0.4

3 months

POP etc.
3D mounting

TVA

M705

Fluid characteristic enables consistent volume for large quantity transfer. Excellent self alignment properties, good results even with warped CSP packages

30

0.2

3 months

Mobile/outdoor devices General printing

GRN360-S

M705

Optimized for the most harsh thermal cycle environments. Flux residue resists cracking and remains clear colored. N2 reflow recommended.

200

0.4

6 months

Cleansing General printing

345F

M705

Developed for easy cleaning using various systems. Compliant with standard SMT applications.

200

0.4

6 months

Die bond soldering

374FS

M705:M34
(Sn-1.0Ag-0.5Cu)

Minimized voiding under bare chip, with easily cleanable flux residue.

150

0.5

3 months

Micro bump forming

FCR

M705:M34

Excellent fine pitch printing characteristics, with emphasis on low voiding ease of cleaning. N2 reflow recommended.

250

0.15

3 months

Dispenser

DSR1

M705

Dispensable paste with improved wetting various surfaces such as brass, Ni plating, etc. Clean DI wash capability. High hot slump resistance.

70

-

3 months

Sn In   type

Low heat resistant components. General printing

IN7

M716            Sn-3.5Ag-0.5Bi-8.0In

Compliant with standard SMT requirements and including additional tombstoning resistance.

200

0.4

3 months

Sn Bi  type

Low heat resistant components. General printing

BLT5

L20(Sn-58Bi)  L23(Sn-57Bi-0.1Ag)

Bi containing pastes with improved wetting solder ball and antioxidant properties.

200

0.4

3 months

Sn Zn Bi type

Low heat resistant components. General printing

SSG010

L11               Sn-0.8Zn-3.0Bi

Zn and Bi Containing paste with excellent reliability results even after environmental testing(85C/85%RH). Designed to reduce solder balling and improve preheating  slumping resistance.

200

0.4

3 months