The history of soldering goes back some 5,000 years, but fundamental soldering has always used Sn-Pb series solder that consists of tin and lead. However, lead pollution ground water has been recognized as an environmental problem and complete elimination of the use of lead is called for.
Realizing that protection of our environment is our task in the 21st century, SMIC has earnestly extended our research in this area and developed Lead-Free "ECO SOLDER."
Please contact us for any problem that relates to Lead-Free soldering. We are thoroughly prepared to introduce Lead-Free soldering system as we have a comprehensive technology base and have constructed support systems in various phases with ECO Soldering Solution™.
JIS Z 3282 / ISO9453: Chemical composition of lead-free solders
| Class | Symbol | SMIC Item | |
|---|---|---|---|
| 1 | 2 | ||
|
Sn 96.5 Ag 3 Cu 0.5 |
Sn 96.5 Ag 3 Cu 0.5 |
A30C5 | M705 |
| Chemical Composition Mass％ | |||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Sn | Pb | Sb | Bi | Cu | Au | In | Ag | Al | As | Cd | Fe | Ni | Zn |
| Remain |
0.10 max |
0.10 max |
0.10 max |
0.3 to 0.7 |
0.05 max |
0.10 max |
2.8 to 3.2 |
0.001 max |
0.03 max |
0.002 max |
0.02 max |
0.01 max |
0.001 max |
* SMIC's lead-free alloys are produced impurity less than 0.05%.
ECO SOLDER
Lead-Free ECO SOLDER developed by SMIC offers high soldering reliability compared with the Sn-Pb series solder of the past and is available in a wide product lineup according to the required soldering temperature.
E series（antioxident type）and automatic feeding type for solder bath are also available.
Product availability may be limited for certain alloy compositions. Please select the appropriate product from the ECO SOLDER Products Guide below.
ECO SOLDER Products Guide
| Item | Alloy composition (wt%) |
Temp. (°C) Solidus line / Peak[1] / Liquidus line |
Form | Remarks | ||||||
|---|---|---|---|---|---|---|---|---|---|---|
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| M-series: Solidus line temp. 200 to 250 °C | ||||||||||
| M705 | Sn-3.0 Ag-0.5 Cu | 217 | 219 | 220 |
 |
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|
*1 |
| M31 | Sn-3.5Ag-0.75Cu | 218 | 219 | 219 |
|
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|
|
*1 |
| M35 | Sn-0.7Cu-0.3Ag | 217 | 219 | 227 |
|
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|
*2 |
| M771 | Sn-1.0 Ag-0.7 Cu | 217 | 219 | 224 |
|
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|
|
*2 |
| M10 | Sn-5.0Sb | 240 | 243 | 243 |
|
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| M20 | Sn-0.75Cu | 227 | 229 | 229 |
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| M24E | Sn-0.70Cu-0.03Ni-P | 228 | 230 | 230 |
|
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|
*3 | ||
| M30 | Sn-3.5Ag | 221 | 223 | 223 |
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| M34 | Sn-1.0Ag-0.5Cu | 217 | 219 | 227 |
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| M37 | Sn-4.0Ag-0.9Cu | 217 | 219 | 230 |
|
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|
*4 | |
| M42 | Sn-2.0Ag-0.75Cu-3.0Bi | 207 | 214 | 218 |
|
|
*5 | |||
| M52 | Sn-1.0 Ag-0.1 Cu-0.05 In-0.02Ni | 218 | 219 | 228 |
|
|||||
| M707 | Sn-2.0Ag-0.5Cu | 217 | 218 | 223 |
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| M714 | Sn-3.8 Ag-0.7 Cu | 217 | 219 | 225 |
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| M715 | Sn-3.9Ag-0.6Cu | 217 | 219 | 226 |
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| M716 | Sn-3.5Ag-0.5Bi-8.0ln | 197 | 208 | 214 |
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*6 | |||
| M731 | Sn-3.9 Ag-0.6 Cu-3.0 Sb | 221 | 224 | 226 |
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|||||
| DY Alloy | Sn-1.2Ag-4.0Cu | 217 | 225 | 353 |
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| M709 | Sn-0.5 Ag-6.0 Cu | 217 | 226 | 378 |
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| M33 | Sn-2.0Ag-6.0Cu | 213 | 219 | 380 |
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| L-series: Solidus line temp. under 200 °C | ||||||||||
| L11 | Sn-8.0Zn-3.0Bi | 190 | 197 | 197 |
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| L20 | Sn-58Bi | 139 | 141 | 141 |
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| L23 | Sn-57Bi-1.0Ag | 138 | 140 | 204 |
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|
*7 | ||
[1] Peak temp. : Max. endothermic reaction point on DSC curve.
*1: JP PAT No. 3027441, US PAT No. 5527628
*2: Low Ag content alloy on JEITA'S recommendations.
*3: JP PAT No. 3622788, Sn-Cu Alloy for anti-shrinkage cavity
*4: Alloy for anti-shrinkage cavity
*5: US PAT No. 4879096, CN PAT No. 1299471
*6: JP PAT No. 3040929
*7: US PAT No. 5320272
